Kit Contents: DIP-24 Dev Module VNC2-48Q
7RS-30C - Ultrasonic Sensor
Silicon Core Number: ATmega328
MULTICOMP PRO - MCRL6655 - Plastic Enclosure
KYOCERA AVX - 06035C103KAT2A - SMD Multilayer Ceramic Capacitor
188744-1 Contact, Crimp, Socket, 28-24AWG, Reel Amp - Te Connectivity Kit Contents: DIP-24 Dev ModuleAMP TE CONNECTIVITY 188744 1 Contact, HE14, Socket, Crimp, 24 AWG, Tin Plated Contacts, HE13 HE14 Series Housing Connectors Product Range: HE14 Series Contact Gender: Socket Contact Termination Type: Crimp Wire Size AWG Max: 24AWG Contact Plating: Tin Plated Contacts For Use With: HE13 HE14 Series Housing Connectors Wire Size AWG Min: 28AWG Contact Material: Phosphor Bronze SVHC: No SVHC (15 Jan 2018) Cable Diameter Max: 1. 5mm Cable Diameter Min: 0.